Peak fringe scanning microscopy (PFSM): submicron 3D measurement of semiconductor components

P. Montgomery , J. Fillard

SPIE Interferometry: Techniques and Analysis , Volume 1755 , page 12-23 - 1993

International conference with proceedings Peak fringe scanning microscopy (PFSM): submicron 3D measurement of semiconductor components, SPIE Interferometry: Techniques and Analysis, San Diego, United States, pages 12-23, SPIE (Eds.), Eds G. Brown, O.Y. Kwon, M. Kujawinska & G.T. Reid, Volume 1755, février 1993, doi:10.1117/12.140772 Research team : IPP

@Inproceedings{4-MF93,
 author = {Montgomery, P. and Fillard, J.},
 title = {Peak fringe scanning microscopy (PFSM): submicron 3D measurement of semiconductor components},
 booktitle  = {SPIE Interferometry: Techniques and Analysis},
 volume = {1755},
 pages = {12-23},
 month = {Feb},
 year = {1993},
 editor = {SPIE},
 publisher = {Eds G. Brown, O.Y. Kwon, M. Kujawinska & G.T. Reid},
 organization = {SPIE},
 doi = {10.1117/12.140772},
 x-international-audience = {Yes},
 x-language = {EN},
 url = {http://publis.icube.unistra.fr/4-MF93}
}

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